Amaoe OV 7 BGA Reballing Stencil for OPPO and VIVO 0.12MM
The AMAOE OV 7 BGA Reballing Stencil is expertly designed for OPPO and VIVO motherboard repair and IC reballing tasks. Engineered with 0.12MM high-precision Japanese steel, this stencil ensures consistent solder deposition and optimal alignment for CPU, eMMC, and power ICs.
Key Features
- Model: OV 7 – Compatible with most OPPO and VIVO logic board IC layouts
- Material: Premium Japanese steel sheet
- Stencil Type: BGA reballing with square mesh pattern
- Thickness: 0.12MM – precise and thermally efficient
- Reusability: Highly durable and can be used multiple times
- Application: CPU, power IC, NAND, and eMMC chip soldering
- Heat Resistance: Withstands high-temperature rework environments
- Performance: Ensures strong tin planting with minimal leakage
Installation Tips
- Clean the stencil and chip with IPA before use
- Align precisely with the IC footprint
- Use high-quality flux for smooth solder deposition
- Avoid overheating during tin planting
Model Numbers Supported ;
- 78207
- RR88643
- VC7643
- 77048E
- 77042
- VC7916-65
- WCN3950
- BGA254
- WCD9370
- SM6225
- ZK8903
- SM7450
- PM6225
- PM7350C
- SDR735
- WCN6750
- PM7325
- WTR2965
- RENO 8 PRO
- A36
- Y32
- IQOO U5X
- NOVA9SE
- 50 PRO
- CIVI 2
Package Content*
