Amaoe OV 8 BGA Reballing Stencil for OPPO and VIVO: 0.12mm

Amaoe OV 8 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM

The Amaoe OV 8 BGA Reballing Stencil is purpose-built for reworking and reballing Power ICs in OPPO and VIVO smartphones. Crafted with high-precision Japanese steel, this stencil ensures accurate tin planting, making it ideal for technicians handling delicate soldering tasks. Its optimized 0.12MM thickness allows consistent solder application without deformation, even with repeated use.

Key Features

• Model: OV 8 Series
• Device Compatibility: OPPO and VIVO smartphones
• Material: Japanese Stainless Steel Sheet
• Thickness: 0.12MM for precise reballing
• Reusability: Long-lasting with anti-deformation durability
• Hole Design: Optimized square layout for Power IC soldering
• Use Case: Reballing and soldering of CPU, PMIC, NAND, and other chips

• AMAOE branding ensures high manufacturing standards
• Stencil can withstand multiple heating cycles without warping
• Designed for ease of alignment and error-free BGA work

Installation Tips

• Clean the IC and stencil surface before use
• Align the chip with the stencil holes carefully
• Use a preheater or hot air station for better tin flow
• Avoid excessive heat to maintain stencil shape

Model Numbers Supported;

• MPSN27
• VC7530
• MT6360UP
• MT6315NP
• 9902-11
• QPM5577
• VC7916-55
• BGA254
• MT6190MV
• SDR735
• MT6365VPW
• RT9759
• MT6855V
• MT6833V
• SM6375
• 429
• VC7643
• MT6369AP
• PM6375
• MT6363CW
• WCN3988
• QDM3301
• SC8571

Package Content*

• 1 x Amaoe OV 8 BGA Reballing Stencil