-18 %
AMAOE SM-918U/W/O/D MIDDLE FRAME BGA REBALLING STENCIL FOR SAMSUNG GALAXY S23 ULTRA - 0.12MM
Product Id: 3668
- Item Code/Product Code: S918-012
- Weight: 0.01kg
₹165.00
₹200.00
Ex Tax: ₹165.00
Precision Stencil for Samsung Galaxy S23 Ultra- Sm-918U/W/O/D Circuitry Repairs:
- Model-Specific Design: Tailored specifically for the Samsung Galaxy S23 Ultra - Sm-918U/W/O/D, ensuring a perfect fit for precise repair work.
- High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding component placement.
- Ultra-Thin Construction: Only 0.12MM thickness for superior flexibility and ease of use on intricate circuit boards.
- Durable Material: Crafted from high-grade, heat-resistant material to withstand the rigors of repeated use in high-temperature rework and soldering processes.
- Alignment Markings: Clear indicators for proper orientation and placement, ensuring flawless operation during micro-soldering tasks.
- Uniform Hole Distribution: Strategically placed holes to provide even distribution of soldering paste and minimize waste.
- Versatile Application: Suitable for various rework scenarios, including soldering, component replacement, and bridge prevention.
- Easy to Clean and Maintain: The stencil can be easily cleaned with standard solvent to ensure long-term usability.
- Protective Packaging: Comes with appropriate packaging to protect against bending and damage during storage or transport.
This professional-grade stencil is an essential tool for technicians specializing in mobile phone repairs, offering reliability and precision in one package.
Package Content*
1 x Stencil.
Tags:
AMAOE
, BALL PLATE
, PCB REBALLING STENCILS
, STENCILS
, MIDDLE LAYER
, REBALLING STENCILS
, BGA REBALLING PLATE
, SAMSUNG STENCILS
,