Amaoe U-MTK8 Stencil for MTK Dimensity Chipsets

Amaoe U-MTK8 Dimensity Reballing Stencil for MTK 7200 Ultra 7300x 6100+ Chipsets

Amaoe U-MTK8 stencil is built for precision BGA reballing of popular MediaTek Dimensity CPUs including 7200 Ultra, 7300x, 6100+, MT6886, MT6878, and more. Crafted from high-quality steel, it ensures tight solder ball alignment for efficient IC repair. Trusted by technicians for reballing performance, long stencil life, and universal compatibility with MTK chips.

Features

• Original Amaoe U-MTK8 model
• High-tensile stainless steel for durability
• Precise IC pad layout for Dimensity series
• Fast heat conduction and low distortion
• Reusable and easy to clean
• Ideal for hot air reballing machines

Key Specification 

Benefits

• Ensures clean and consistent soldering for Dimensity ICs
• Reduces risk of chip misalignment or solder bridges
• Perfect fit reduces rework errors
• Boosts repair speed and quality for modern MTK SoCs

Main Supported IC Models:

• MT6886V
• MT6878V
• MT6835V
• MT6781V

Additional Modules Printed on the Stencil:

• 115749–2R
• MT6631N
• 77042
• 580S1–11
• GK200A0
• BGA100
• BGA153
• BGA254
• VC7916
• VC7643
• 77298

Sub-ICs Listed Below Main Chips:

• T6168MV
• MT5386CW
• MT6197W
• MT6190W
• MT5377W

Technician Notes / Usage Guidance

Use flux and preheat platform before applying the stencil. Ensure stencil is aligned with chip pads. For better results, use under a microscope and controlled airflow. Clean stencil after use to maintain precision.

Package Included

• 1 × Amaoe U-MTK8 BGA Reballing Stencil

FAQ

• Q1: Is this stencil suitable for other chipsets beyond the listed ones?
• A1: It is optimized for MTK Dimensity models listed above; using it for others may cause misalignment.
• Q2: Can I use this with infrared rework stations?
• A2: Yes, it works with most hot air or IR BGA rework systems.
• Q3: Is the stencil reusable?
• A3: Yes, it can be reused multiple times with proper cleaning and care.