Id: 4247
- Item Code/Product Code: U‑SMG4
- Weight: 0.10kg
- SKU: 47777
Amaoe U-SMG4 Reballing Stencil for Samsung CPU Exynos 880/ 980/ 1080/ 1280/ E882
The Amaoe U‑SMG4 is a pro‑grade 0.12 mm spring‑steel BGA stencil engineered for fast, consistent reballing across a wide roster of Samsung/Exynos application processors, PMICs, RF, and companion ICs. Precision‑etched apertures, flat seating, and heat‑tough construction deliver uniform ball formation with less paste bleed and fewer bridges—ideal for mobile logic board rebuilds under a microscope. Clearly labeled patterns match popular ICs like Exynos 880/980/1080/1280/E8825 plus PMICs (SM5714, S2MU106), RF front‑end parts (QPA4580/QPA5580), baseband SHANNON series, and multiple BGA153/BGA254 footprints. If you need repeatable results and lower rework time, U‑SMG4 is the reliable, reusable stencil trusted by technicians.
Features
- High-quality stainless steel construction for durability and precision.
- Thickness: 0.12mm stable reballing with minimal heat distortion.
- Compatible with Samsung Exynos series and Shannon PMIC chips.
- Anti-deformation and corrosion-resistant for long-term usage.
- Accurate laser-cut holes ensure precise solder ball placement.
- Designed for professional BGA rework and IC repair labs.
Key Specification
| Specification | Details |
|---|---|
| Brand | Amaoe |
| Model | U-SMG4 |
| Material | High-Quality Stainless Steel |
| Application | Samsung Exynos / IC Reballing |
| Compatibility | CPU, PMIC, RF, Shannon ICs, RAM |
| Supported Packages | BGA153, BGA254 |
| Process | Precision Laser-Cut |
Supported Models / Chipsets
- Exynos Series: Exynos 1080, Exynos 880, Exynos 980, Exynos 1280, Exynos E8825
- Shannon ICs: Shannon 5510, Shannon 5511
- Power ICs & PMICs: S2MU106X01 S3700, SM5714, SPU13 / SPU14
- RF & Communication ICs: QPA5580, QPA4580, QFM3576
- Memory ICs: RAM 556
- BGA Packages: BGA153, BGA254
- Other Supported IC Codes: W2205, $6565, 78201, 8267-11, 53735-21, 770988, 77040, 77032, 280040, $5288, 60B2VTT, 58083-11
Benefits / Usages
- Provides chip-level accuracy for Samsung IC repair.
- Enhances success rate of motherboard rework.
- Saves cost by enabling chip reuse.
- Prevents misalignment with precise solder ball distribution.
- Trusted by professional mobile repair technicians.
Installation Tips
- Use with a reballing jig for stability.
- Clean IC surface properly before applying solder paste.
- Maintain uniform heating with rework station.
- Store stencil flat to preserve hole precision.
Package Content
- 1 x Amaoe U-SMG4 Reballing Stencil
FAQs
- Q2: Which ICs does it support?
- A: The plate includes patterns for Exynos 880/980/1080/1280/E8825, SHANNON 5510/5511, SM5714, S2MU106X01 S3700, QPA4580/QPA5580, QFM3576, BGA153, BGA254, and more as printed on the sheet.
- Q3: Can I use both paste and loose balls?
- A: Yes. Use quality flux; choose ball size per IC spec. 0.12 mm thickness suits common 0.25–0.35 mm balls.
- Q4: How do I prevent warping or bridges?
- A: Use moderate, even heat; keep the stencil flat; apply a thin paste layer; let the plate cool before removal.
- Q5: Is it reusable?
- A: Yes—spring steel withstands many heat cycles. Clean with IPA, dry thoroughly, and store in the sleeve.
- Q6: Will it fit all Samsung chips?
- A: It covers many popular packages, but always verify alignment with your specific IC footprint before reflow.
