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HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR

HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
New -25 %
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
HONG HAI TONG MAGIC PAD HIGH TEMPERATURE RESISTANT SILICONE PAD FOR CPU REBALLING & FACE ID REPAIR
  • Product Id: 3924

  • Item Code/Product Code: MAGIC PAD
  • Weight: 0.05kg
₹299.00
₹400.00
Ex Tax: ₹299.00
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Multi-functional positioning pressure-reducing magic protective pad supports for iPhone X-11 lattice fixed pad 7G-8P fingerprint CPU repair, 115x97mm tin planting thermal silicone mat. Hong Hai Tong magic pad is used to repair the iPhone X-11Pro Max face dot matrix repair 7-8P fingerprint CPU.


Product Description : 

  • iPhone X Face Component Groove *1
  • iPhone XS Face Component Groove *1
  • iPhone 11 Face Component Groove *1
  • iPhone 12 Face Component Groove *1
  • iPhone Dot Matrix Component Groove *1
  • iPhone Infrared Front Camera Groove *1
  • iPhone Fingerprint Groove* 2
  • CPU Placement groove *1


Product Features : 

  1. A tool, specifically designed for repairing BGA chips of electronic products.
  2. Effectively avoid tin messing caused by the deformation of steel mesh.


Packing List : 

1pc x Magic Pad




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