Koocu Universal Black Stencil Plate 0.12MM

Premium universal black BGA reballing stencil for Qualcomm, MediaTek and Snapdragon processors. Precision-engineered for perfect solder ball placement during chip repairs.

Features:

1. Universal design compatible with multiple chip types
2. High-temperature resistant black material
3. Precision-machined holes for accurate ball positioning
4. Anti-static properties for component protection
5. Durable construction for repeated use

Package includes:

• 1 x Stencil