Mechanic XP4 148°C Solder Paste 35g low temperature formula for safe PCB rework

Mechanic XP4 Low Melt Solder Paste For Heat Sensitive IC And PCB Work

Mechanic XP4 148°C solder paste is designed to solve one of the most common problems in modern mobile repair: heat damage during IC soldering. Standard high-temperature solder often causes PCB pad lifting, IC deformation, or nearby component failure. XP4 uses a low melting point formula that flows smoothly at 148°C, allowing technicians to perform IC reballing and micro soldering with better control, lower thermal stress, and cleaner joints. This makes it ideal for multilayer PCBs, thin logic boards, and sensitive power IC areas. Mechanic XP4 solder paste is used during IC reballing, power IC replacement, CPU corner work, and fine PCB soldering where high heat can damage board layers. It is especially useful for mobile phones with thin multilayer boards and compact component layouts.

Key Features

• Low melting point at 148°C reduces PCB and IC heat damage
• Fine 4.3 micron alloy particles for smooth and even solder flow
• Stable paste consistency prevents splashing and ball scattering
• Strong wetting ability improves pad adhesion and joint reliability
• Suitable for precision IC work on modern smartphones and tablets

Specification Key

Usage

• Used for low temperature PCB and IC soldering
• Helps protect delicate pads and multilayer boards
• Ideal for mobile phone motherboard repair
• Improves joint reliability without excess heat
• Better control compared to high temperature solder paste

Installation Tips

• Clean PCB pads before applying solder paste
• Apply a small controlled amount on solder points
• Use hot air or soldering station with proper airflow
• Avoid excessive heat beyond required melting point
• Store paste sealed after use to maintain consistency

Product Package

• 1x Mechanic XP4 148°C Solder Paste 30g

FAQs

• Q1. Why is this product needed for PCB repair
• Low temperature solder paste reduces heat stress on PCB pads and sensitive components, helping prevent damage during rework.
• Q2. Can this solder paste be used for mobile motherboard repair
• Yes, it is suitable for mobile phone PCB, IC, and chip level soldering where controlled heat is required.
• Q3. Is Mechanic XP4 suitable for hot air rework stations
• Yes, it works effectively with hot air stations when proper temperature control is used.
• Q4. What is the limitation of this solder paste
• It is designed for low temperature applications and may not be suitable for high temperature industrial soldering.
• Q5. Does paste consistency affect solder joint quality
• Yes, smooth and stable paste helps improve wetting and joint strength during precision repair.