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PM6150-002 Power Management IC for Mobile CPU Reballing - Original

PM6150-002 Power Management IC for Mobile CPU Reballing - Original
PM6150-002 Power Management IC for Mobile CPU Reballing - Original
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PM6150-002 Power Management IC for Mobile CPU Reballing - Original
PM6150-002 Power Management IC for Mobile CPU Reballing - Original
PM6150-002 Power Management IC for Mobile CPU Reballing - Original
  • Id: 4171

  • Item Code/Product Code: PM6150-002
  • Weight: 0.01kg
  • SKU: 16545
₹160.00
Ex Tax: ₹160.00
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PM6150 002 Original Power IC for Vivo V15 Pro, Redmi Note 7 Pro, Samsung Galaxy A70 and Realme 5 Pro

The PM6150-002 mobile power IC is designed for advanced power control in Snapdragon-based smartphones. Ideal for board-level repair, especially in CPU reballing and no-power issues. Supports stable current flow and protects key components during rework jobs.

Features:

  • Original PM6150-002 IC for CPU & GPU power supply
  • Compatible with Snapdragon-based motherboards
  • Excellent heat control and voltage regulation
  • Preferred by reballing and IC replacement labs
  • High efficiency, low failure rate

Specification:

  • IC Version: PM6150-002
  • Chipset Compatibility: Snapdragon 600–700 series
  • Operating Voltage: 1.8V–4.1V
  • Package: BGA
  • Condition: Brand New, Original

Supported Modules:

  • Compatible with Snapdragon 675/ Snapdragon 712/ Snapdragon 720G
  • Found in devices like Vivo V15 Pro, Redmi Note 7 Pro, Samsung Galaxy A70, Realme 5 Pro
  • Also referenced in PMI632 IC support model listings

Technician Notes / Usage Guidance:

  • Always clean pad area before applying solder paste
  • Use a hot air rework station between 270–290°C
  • Avoid excess pressure while placing BGA
  • Store unused ICs in ESD-safe containers
  • Check schematic before installation for matching voltage

Package Included:

  • 1× PM6150-002 Power IC

FAQs:

  • Q. What is PM6150-002 IC used for?
  • It powers mobile CPUs and helps in fixing power faults or boot issues.
  • Q. Is it similar to PMI632 IC?
  • Yes, both are used in Snapdragon-based power management but differ in module compatibility.
  • Q. Can I use it for CPU reballing?
  • Absolutely. It's optimized for use in high-heat repair jobs and BGA rework.


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