Out Of Stock
QIANLI QS-63 BGA Reballing Stencil for SM6115 SM6125 SM6225 CPU IC
Id: 4053
- Item Code/Product Code: QS 63
- Weight: 0.05kg
- SKU: 21562
₹199.00
Ex Tax: ₹199.00
QIANLI QS-63 BGA Reballing Stencil offers precision reballing for SM6115, SM6125, SM6225 CPU ICs. Ideal for professional mobile motherboard repair and soldering. BGA IC Fixing Kit
Features:
- Made of strong stainless steel
- 0.12mm thickness for accuracy
- Reusable and durable
- Easy to use for mobile repair
- Durable, reusable design for professional rework environments
- Precision-aligned holes for accurate solder ball placement
Model Numbers Supported:
- SM6115
- SM6125
- SM6225
Package includes:
- 1 x Stencil
