-550x550.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-550x550.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-550x550.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-550x550.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-550x550.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-550x550.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
New
-80x80.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-80x80.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-80x80.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-80x80.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-80x80.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-80x80.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair
Id: 4082
- Item Code/Product Code: Arc Pad
- Weight: 0.08kg
₹299.00
Ex Tax: ₹299.00
YCS Arc Pad BGA Tin Planting Mat with Magnetic Steel Mesh for CPU/IC Repair
The YCS Tin-Planting Arc Pad is a high-precision tool for IC and BGA chip tin planting. It helps in forming uniform solder balls, reducing errors in reballing processes. Ideal for technicians and repair professionals handling micro-soldering tasks.
Features:
- Brand: YCS
- Type: Tin-Planting Arc Pad
- Use: Solder ball tin planting for BGA/IC
- Surface: Anti-static and heat-resistant
- Design: Arc-type layout for even ball distribution
- Durability: Reusable and washable
- Application: IC/BGA reballing and repair
Benefits
- Ensures consistent solder ball placement
- Saves time and reduces manual errors
- Anti-static surface protects delicate chips
- Boosts reballing accuracy and efficiency
Package Included:
- 1 × YCS Tin-Planting Arc Pad
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%202-250x250.jpg "YCS 138℃/183℃/199℃ Solder Paste For BGA CPU PCB Motherboard Repair")
%203-250x250.jpg "YCS 138℃/183℃/199℃ Solder Paste For BGA CPU PCB Motherboard Repair")
%201-250x250.jpg "YCS 4 IN ONE SOLDER PASTE SET 138℃/183℃/199℃ WITH YCS 2015 DESOLDER WICK")
