YCS Magnetic Pad for IC Reballing & BGA Tin Planting – Anti-Slip Base

The YCS Strong Magnetic Pad Chip is engineered to hold small and medium ICs, chips, or CPUs steadily during reballing or soldering. This anti-slip magnetic base ensures precision placement and stability without damaging the chip surface. Especially helpful for mobile repair professionals working with CPUs, PMICs, and NAND ICs.

Top Features

• Strong Magnetic Hold: Ensures chips stay fixed during work
• Anti-Slip Base: Won’t shift on your desk or platform
• Ideal for CPU/IC Positioning: Designed for reballing, polishing, or laser work
• Durable, Heat-Resistant Surface: Handles hot air and heat gun exposure
• Compact & Efficient Design: Saves space on rework stations

Specifications

• Product Name: YCS Arc Pad Tin Planting Mat
• Material: Magnetic Steel + Heat-resistant Pad
• Type: BGA Tin Planting / Soldering Mat
• Compatibility: CPU, IC, NAND, HDD Chips
• Reusability: Yes
• Surface Type: Anti-slip Arc Design
• Usage: Phone PCB Repair, Chip Reballing
• Portability: Compact and lightweight

Benefits for Technicians

• Speeds up reballing by fixing the chip in one place
• Reduces risk of IC shifting during soldering or cleaning
• Prevents overheating impact due to elevated magnetic layer
• Great for use with IC Stencils, UV Green Oil, or polishing

Package Included: