Name: 2uul FD40 Chip Heating Glue Removal Station for CPU IC Clean
Brand: 2UUL
SKU: 54380
Price: 450 INR
Availability: InStock

2uul FD40 Chip Heating Glue Removal Station for CPU IC Clean

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2uul FD40 Chip Heating Glue Removal Station for CPU IC Clean

Product Id: 4748
Item Code/Product Code: Mini one
Weight: 0.15kg
SKU: 54380

2UUL

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₹450.00

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Description
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2UUL FD40 Chip Heating Glue Removal Station for CPU IC Glue Cleaning and Chip Repair

The 2UUL FD40 Chip Heating Glue Removal Station is a professional chip repair tool designed for safely heating and removing adhesive around CPU, IC, and chipset packages during mobile phone motherboard repair. By applying controlled heat between 180°C and 200°C, the FD40 softens hardened glue, making it easier to clean adhesive without damaging surrounding components. Its compact design, adjustable positioning, and precision heating probe provide repair technicians with greater control during chip-level maintenance and motherboard restoration.

Product Features

Professional chip heating glue removal station.

Designed for CPU and IC adhesive removal.

Heating temperature range from 180°C to 200°C.

Softens hardened glue for easier cleaning.

Precision heating probe for accurate operation.

Compact lightweight design.

Adjustable positioning screw for stable use.

Reduces risk of damaging surrounding PCB components.

Suitable for chip-level motherboard repair.

Easy to install and operate.

Professional repair quality.

Ideal for mobile repair technicians.

Product Specifications

Brand	2UUL
Model	FD40
Product Name	Find 210 Chip Heating Glue Removal Station
Working Temperature	180°C – 200°C
Product Size	90 × 23 × 5mm

Heating Block Size	16 × 17mm
Package Size	130 × 39 × 11mm
Net Weight	7g
Gross Weight	14.4g
Application	CPU IC Glue Removal and Motherboard Repair

Why Choose 2UUL FD40?

Softens adhesive quickly for safer glue removal.

Helps prevent PCB and IC damage during repair.

Compact design provides excellent working control.

Precision heating improves repair efficiency.

Suitable for professional chip-level servicing.

Lightweight and portable.

Reliable for daily repair work.

Perfect for electronics repair laboratories.

Applications

CPU glue removal.

IC adhesive cleaning.

Mobile phone motherboard repair.

Chip-level repair.

BGA repair preparation.

PCB maintenance.

Electronics repair workshops.

Professional repair laboratories.

Frequently Asked Questions

It is designed to heat and soften adhesive around CPU and IC chips, making glue removal safer and easier during motherboard repair.

The FD40 operates within a heating range of approximately 180°C to 200°C.

Yes. It is specifically designed for chip-level mobile phone motherboard maintenance and CPU repair.

Yes. Controlled heating softens glue without excessive force, reducing the chance of damaging nearby components.

The FD40 is ideal for professional mobile repair technicians, motherboard engineers, and electronics repair laboratories.

Tags: 2uul , FD40 , Glue Removal Station , CPU Glue Removal ,

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