Bagua Mini-One Heater IC Glue Removal Heater 160°C–250°C

Bagua Mini One Heater IC Glue Removal Heater 160°C–250°C Range for Mobile Logic Board Repair

Bagua Mini-One Heater IC Glue Removal Heater is a compact, high-efficiency heating tool specially designed for safe and precise IC glue removal in mobile phone logic board repair. With a controlled temperature range of 160°C to 250°C, it allows professional technicians to soften and remove black glue, underfill, and sealing adhesive without damaging nearby components. The miniature design with a directional heat nozzle ensures heat is applied only where needed, reducing the risk of board warping or component desoldering. Compatible with most workstations and ideal for BGA chip, CPU, NAND, and IC removal.

Features:

• Adjustable heating range: 160°C to 250°C
• Mini compact size, saves space on workbench
• Ideal for IC rebonding, chip-off, glue softening
• Provides stable and uniform heating across surface
• Low power consumption, suitable for long operation
• Easy installation with mounting slots
• Durable aluminum build for long-term professional use
• Suitable for black glue, hard glue, UV glue removal
• Compatible with all types of mobile logic boards
• Enhances chip-level repair accuracy and safety

Best Use Practices:

• Preheat to desired temperature (start from 180°C for black glue).
• Position tip close to the IC edge without touching it directly.
• Allow glue to soften before removal to avoid PCB pad lifting.
• Use with magnification tools for precision work.

Technical Specifications:

Package Includes:

• 1 x Bagua Mini-One Heater IC Glue Removal Tool

Frequently Asked Questions

• Q1: What is the use of the Bagua Mini-One Heater?
• A1: It is used to heat and soften black glue or underfill around ICs, making it easier and safer to remove components like CPU or NAND chips.
• Q2: Can it damage nearby components?
• A2: No, the mini nozzle is designed to provide focused heat, minimizing exposure to surrounding parts.
• Q3: What power source is required?
• A3: It works with standard mobile repair DC workstations or compatible power modules.
• Q4: Is it suitable for BGA and NAND chip repair?
• A4: Yes, it's ideal for precise heating required during BGA, CPU, and NAND chip removal and rework.
• Q5: What's the recommended working temperature?
• A5: Start at around 180°C for most black glue; adjust up to 250°C depending on glue thickness and IC type.