2UUL MODEL Y HAND FINISH BLADES FOR MOBILE MOTHERBOARD GLUE AND IC REMOVAL

2UUL Model Y Hand Finish Blades for Mobile Phone Screen Debonding / Removal IC

Features:

• Double-sided uniform trimming, utility model patented technology
• The blade is from thin to thick, and the force is more uniform
• It is suitable for removing glue from the screen and removing the CPU, screen IC, mobile phone motherboard, small parts such as separators, chips, etc
• Upgraded to a more practical bent-blade design, by bending the blade, the loss to the motherboard, chip, screen, etc is realized and reduced, thereby improving the yield
• Nano-coating is anti-rust, the blade body is flexible, thin, and elastic, the thickness of the blade tip is equal to 0.06mm, and the thickness of the blade tail is about 0.3mm

Package includes:

• 4 x Blades