2UUL Red Skull Solder Paste All Temperature Series for Micro Soldering Repair

2UUL Red Skull Solder Paste 138°C 148°C 183°C 199°C All Series for Mobile PCB Repair

2UUL Red Skull Solder Paste is a professional grade soldering material designed for precise PCB repair, micro soldering, and electronic component rework. This premium solder paste is available in multiple temperature variants including 138°C, 148°C, 183°C, and 199°C, allowing technicians to choose the ideal melting point for different repair applications. Each temperature series is specifically formulated to provide smooth melting, strong adhesion, and clean solder joints, making it suitable for mobile phone motherboard repair, BGA reballing, IC soldering, and delicate circuit work. The low temperature variants are ideal for heat sensitive components, while higher temperature options provide stronger and more durable solder connections. The Red Skull series is known for its stable performance, minimal residue, and easy handling, helping technicians achieve professional quality soldering results. Whether working on smartphone PCBs, laptops, or other electronic devices, this solder paste ensures reliable bonding and improved repair efficiency. For professional technicians and repair workshops, 2UUL Red Skull Solder Paste provides a complete solution for multi temperature soldering needs in one product range.

Features

• Multi Temperature Solder Paste Series: Available in 138°C, 148°C, 183°C, and 199°C for different repair requirements.
• Low Temperature Precision Soldering: Ideal for heat sensitive components and delicate PCB repair work.
• High Quality Solder Joint Formation: Provides strong, clean, and reliable solder connections.
• Smooth Melting Performance: Ensures easy application and uniform solder flow during heating.
• Low Residue Formula: Reduces cleaning effort after soldering and improves repair quality.
• Professional PCB Repair Material: Suitable for mobile motherboard repair, BGA rework, and IC soldering.

Specification

Benefits or Usage

• Choose correct temperature based on repair requirement
• Ideal for mobile phone motherboard repair
• Suitable for IC rework and BGA soldering
• Reduces risk of overheating sensitive components
• Improves soldering precision and joint strength

This solder paste series allows technicians to handle different soldering scenarios with the right temperature control.

Temperature Guide (Important for Users)

• 138°C → Ultra low temperature, best for highly sensitive components
• 148°C → Low temperature, ideal for mobile PCB repair
• 183°C → Standard soldering temperature for general electronics
• 199°C → High temperature, strong joints for durable connections

Installation Tips

• Clean PCB surface before applying solder paste
• Apply a small amount on the target soldering area
• Use hot air or soldering station to heat evenly
• Select correct temperature variant based on component sensitivity
• Clean residue after soldering if required

Always use proper temperature control during micro soldering.

Package Content

• 1 × 2UUL Red Skull Solder Paste (Selected Temperature Variant)

FAQs

• What are the available temperature options in 2UUL Red Skull solder paste?
• It is available in 138°C, 148°C, 183°C, and 199°C variants.
• Which solder paste is best for mobile motherboard repair?
• 148°C and 183°C are commonly used for mobile PCB repair depending on the application.
• What is the use of 138°C solder paste?
• 138°C is used for very sensitive components that require low heat exposure.
• Is this solder paste suitable for BGA reballing?
• Yes, it is widely used for BGA reballing and IC soldering.
• Does the solder paste leave residue after use?
• It has a low residue formula, making cleaning easier after soldering.