AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
The AMAOE OV 6 BGA Reballing Stencil is a precision-engineered tool tailored for reballing CPU and IC chips in OPPO and VIVO smartphones. With a thickness of 0.12MM, it offers ideal balance between durability and flexibility, making it a trusted choice among professional mobile repair technicians. Whether you're handling delicate soldering tasks or performing full IC replacements, this stencil ensures accurate ball alignment and excellent thermal stability.
Features:
- Brand: AMAOE
- Model: OV 6
- Stencil Type: BGA Reballing
- Compatibility: Designed for OPPO/VIVO CPU, eMMC, Power IC, and other common chips
- Material: High-quality Japanese steel sheet
- Thickness: 0.12MM for high accuracy and repeatable results
- Reusability: Yes, durable under high-temperature rework conditions
- Hole Design: Ultra-precise laser-cut square holes
- Anti-warp Design: Minimizes warping even under repeated heat exposure
Model Number Supported;
- 77912-61
- 77645-21
- 77612-61
- BGA254
- PM4250
- VC7643
- SM4250
- SM6115
- SM7125
- PMI632
- WTR3925
- PM6250
- SDR675
- PM6150L
- PM4250
- WCN3950
- OPPO : A32
- VIVO : Y30/Y31
- IQOO : U1/UIX
Package Content
- 1X Amaoe OV 4 BGA Reballing Stencil
