Description
B&R IC-18S Dot-Repairing Soldering Lug replace the traditional jumping wire, For Fixing Soldering Spot on Phone Welding Plates. B&R Enhanced Version Solder Piece For Repair Welding,Replace the traditional circling of jump wire to filled the missing solder joint, restore to the original pad and without trace.
Feature:
2nd Generation Enhanced Version
New technology of Repair Welding
Fixed pin of pad : the pads are reinforced with fixed pins and will never fall off.
Ultra-thin experience: it adopts industrial-grade printed circuit board copper foil with a thickness of 30um
Strong bond: The connection joint with the circuit is firm,and can fixed the green oil well.(UV curing solder mask ink)
Good flatness: good flatness, which can prevent pseudo soldering effectively caused by unevenness.
Save time and energy: it saves time and effort and no need to circle during jumping wire so the repair efficiency is relatively high.
Stable welding: The BGA bonding surface has high saturation,stable eledtrical performance,good welding strength,and it is not easy to drop off and unsoldering.
Applicable:
Applicable for dot-faded soldering pad with various shapes and models of soldering lug
Applicable for beauty the pad with seamless repairing
Use:
Effect After Repairing
Curling the wires to make jumper wires is no longer needed. After pads soldering, the double-layered motherboard can be installed to the testing fixture or recombined directly. Repair efficiency will be tremendously increased.
