Description:
mobile phone Motherboard Repair BGA Desoldering wire, absorption wire Soldering Accessory assistant for removes unwanted solder Quickly, Sucking line BGA Desoldering Solder Wire BGA Tin Absorbtion line, Desoldering Wire Solder wick Except for the tin absorbing excess solder.
99.9% pure copper BGA Desoldering wire - Quickly removes unwanted solder when used with a soldering iron, Improve Your mobile phone PCB Desoldering Process
Option BGA Desoldering wire :
GS-2015 DESOLDER WIRE -- 3.0mm Width, 1.5M LENGTH
Feature :
Sucking tin belt is a metal wire braid that utilizes capillary action to absorb molten solder, which is used to remove excess solder, it has good thermal conductivity and excellent ability of absorbing tin, applied to clean the re-soldering point on the motherboard , when use with the soldering station
Make with 99.9% pure copper and special chemicals, make sure good, fast and save material during use process.
Used to remove excess solder during remove tin, high resistant oxidative corrosion, good thermal conductivity, tin absorb, and sucking tin thoroughly
Use :
Place the desoldering wick over the solder to be removed, then push the heated soldering iron tip onto the desoldering wick. The solder will be absorbed.
Remove the desoldering wick after the solder has been absorbed.
Cut off the used section of the wick using nippers.
