![KAISI 220°C HIGH-TEMPERATURE MELTING POINT LEAD-FREE SOLDER PASTE FOR MOBILE PHONE BGA REPAIR - 40G KAISI 220°C HIGH-TEMPERATURE MELTING POINT LEAD-FREE SOLDER PASTE FOR MOBILE PHONE BGA REPAIR - 40G](https://abest.b-cdn.net/image/cache/catalog/KAISI%20220%20PPD-550x550.jpg)
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KAISI 220°C HIGH-TEMPERATURE MELTING POINT LEAD-FREE SOLDER PASTE FOR MOBILE PHONE BGA REPAIR - 40G
Product Id: 3540
- Item Code/Product Code: 220 DEGREE
- Weight: 0.01kg
₹350.00
₹450.00
Ex Tax: ₹350.00
Kaisi 40g 220°C High-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair
Features:
- Kaisi 40g 220°C High-temperature solder paste, a high-temperature lead-free solder paste customised for high-end motherboard repair
- Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store
- High Density/High Resistance Strong Activity/Strong Welding Force
- Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution
- Meet the maintenance needs of motherboards for Huawei and Apple high-end machines
- Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
- Good soldering and welding tool
Package includes:
- 1 x Solder Paste
Tags:
KAISI
, SOLDER PASTE
, PPD PASTE
, REBALLING
, IC REPAIR
, BGA PASTE
, REBALLING PASTE
, 220 DEGREE
,