MIJING Z11 MAINBOARD BGA REBALLING FIXTURE CIRCUIT BOARD REPAIR PLATFORM FOR IPHONE X
Product Id: 2948
- Item Code/Product Code: Z11
- Weight: 0.30kg
₹1,499.00
Ex Tax: ₹1,499.00
Features :
1. Made of high quality aluminum alloy, very good use of accurate positioning fixture.
2. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
3. Repairing problem of iPhone X processor.
Installation Instructions
1. Install the iPhone X main board on the platform.
2. Cover the iPhone X BGA reballing stencil on mainboard.
3. Evenly spread tin on the cover of the reballing stencil.
4. Remove the reballing stencil cover.
5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.
Specification:
Material Aluminium alloy
Size 10*10*1.15cm
Weight 273g
