New
AMAOE BGA iPhone 13 Pro Max Middle Layer Reballing Stencil for A15 Bionic CPU - 0.12MM
Id: 4063
- Item Code/Product Code: MIDDLE LAYER
- Weight: 0.05kg
₹350.00
Ex Tax: ₹350.00
High-precision 0.10mm AMAOE Middle Layer / Frame reballing stencil specifically engineered for iPhone 13 Pro Max MBGA. Features perfect alignment, heat-resistant material, and precise ball placement for professional mobile repair technicians seeking reliable reballing solutions.
Features
- Material & Build: Premium stainless steel with anti-static coating, heat-resistant up to 380°C for durability
- Dimensions: Ultra-precise 0.12 mm thickness with 15mm width for perfect MBGA baseband chip reballing
- Precision Engineering: Laser-cut technology ensuring exact hole alignment for iPhone 13 Pro Max repairs
- Compatibility & Use: Specifically designed for all iPhone 13 Pro Max MBGA baseband IC models with reusable design
- Professional Quality: Includes alignment markers for easy positioning, ideal for mobile repair shops and technicians
Model Numbers Supported
- iPhone 13 Pro Max A2484
- iPhone 13 Pro Max A2641
- iPhone 13 Pro Max A2644
- iPhone 13 Pro Max A2645
Package includes:
- 1 x Stencil
