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Amaoe BS 1 BGA 0.12MM Stencil for Qualcomm SM8250 / SM8350 865 / 870 / 888 / 8350 / 8250

Amaoe BS 1 BGA 0.12MM Stencil for Qualcomm SM8250 / SM8350 865 / 870 / 888 / 8350 / 8250
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Amaoe BS 1 BGA 0.12MM Stencil for Qualcomm SM8250 / SM8350 865 / 870 / 888 / 8350 / 8250
  • Id: 4042

  • Item Code/Product Code: BS-01
  • Weight: 0.05kg
₹145.00
Ex Tax: ₹145.00
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Amaoe BS 1 BGA Reballing Stencil for Black Shark 3 / 3Pro / 3S / 4 / 4Pro / 4S, Snapdragon 865 / 870 / 888 / SM8250 / 8350 Tin Planting Net

Feature:

  1. Designed for a wide range of smartphones including iPhone, Samsung, Xiaomi, Huawei, and more.
  2. Made from high-quality stainless steel for exceptional durability, heat resistance, and long-lasting use.
  3. Smooth surface ensures clean, accurate reballing with excellent solder ball placement.
  4. Ideal for BGA chip rework and logic board repair in professional repair shops or training labs.
  5. Engineered for quick alignment and consistent results, even with fine-pitch components.

Package includes:
      1 x Stencil

Model Numbers Supported:

      BQ24195
      SM8250
      SM8350
      PM8350
      PM8350C
      PM8350BH
      PM8150A
      PM8150B
      PM8250
      PMX55
      SDM845
      SDM888
      SDM439
      SDM670
      SDM845 RAM
      SM8150 RAM
      SM8250 RAM
      SM8350 RAM
      SM8450 RAM
      SM8550 RAM
      RAM496
      RAM556
      SDX55M
      WCN6851
      WCD9380
      SDR865
      SDR868
      QCA6391
      VC7643
      77048E
      77040
      77033D
      100TB28
      BGA153
      PM8450 
      QET7100
      P1
      QET7100

       

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