New
-12 %
AMAOE SAM-18 CPU BGA REWORK REBALLING STENCIL FOR SAMSUNG GALAXY A14 / A54 - 0.12MM
Product Id: 3704
- Item Code/Product Code: SAM-18
- Weight: 0.01kg
₹175.00
₹199.00
Ex Tax: ₹175.00
Precision Stencil for Samsung Exynos Circuitry Repairs:
Features:
- Model-Specific Design: Tailored specifically for the Sam-18 For Samsung series , ensuring a perfect fit for precise repair work.
- High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding component placement.
- Ultra-Thin Construction: Only 0.12MM thickness for superior flexibility and ease of use on intricate circuit boards.
- Durable Material: Crafted from high-grade, heat-resistant material to withstand the rigors of repeated use in high-temperature rework and soldering processes.
- Alignment Markings: Clear indicators for proper orientation and placement, ensuring flawless operation during micro-soldering tasks.
- Uniform Hole Distribution: Strategically placed holes to provide even distribution of soldering paste and minimize waste.
- Versatile Application: Suitable for various rework scenarios, including soldering, component replacement, and bridge prevention.
- Easy to Clean and Maintain: The stencil can be easily cleaned with standard solvent to ensure long-term usability.
- Protective Packaging: Comes with appropriate packaging to protect against bending and damage during storage or transport.
Model supported :
- 58083-11
- 7709B
- SPU15/Q
- SN3U6P23
- SK8K7320
- SPU16
- 180085
- S620
- SPA05
- E8835P
- BGA254
- E8535P
- QPA4580
- 110228
- SM5714
- S6566
- 38P2C
- 8267
- 78078
- QDM3525
This professional-grade stencil is an essential tool for technicians specializing in mobile phone repairs, offering reliability and precision in one package.
Package Content*
1 x Stencil.
Tags:
AMAOE
, BALL PLATE
, REBALLING STENCILS
, EXYNOS
, CPU STENCILS
, SAMSUNG STENCILS
, SAMSUNG A54
, BGA STENCILS
, STENCIL PLATE
, E8835P
, E8535P
,