AMAOE SAM-18 CPU BGA REWORK REBALLING STENCIL FOR SAMSUNG GALAXY A14 / A54 - 0.12MM

Precision Stencil for Samsung Exynos Circuitry Repairs:

Features: 

• Model-Specific Design: Tailored specifically for the Sam-18 For Samsung series , ensuring a perfect fit for precise repair work.
• High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding component placement.
• Ultra-Thin Construction: Only 0.12MM thickness for superior flexibility and ease of use on intricate circuit boards.
• Durable Material: Crafted from high-grade, heat-resistant material to withstand the rigors of repeated use in high-temperature rework and soldering processes.
• Alignment Markings: Clear indicators for proper orientation and placement, ensuring flawless operation during micro-soldering tasks.
• Uniform Hole Distribution: Strategically placed holes to provide even distribution of soldering paste and minimize waste.
• Versatile Application: Suitable for various rework scenarios, including soldering, component replacement, and bridge prevention.
• Easy to Clean and Maintain: The stencil can be easily cleaned with standard solvent to ensure long-term usability.
• Protective Packaging: Comes with appropriate packaging to protect against bending and damage during storage or transport.

Model supported : 

1. 58083-11
2. 7709B
3. SPU15/Q
4. SN3U6P23
5. SK8K7320
6. SPU16
7. 180085
8. S620
9. SPA05
10. E8835P
11. BGA254
12. E8535P
13. QPA4580
14. 110228
15. SM5714
16. S6566
17. 38P2C
18. 8267
19. 78078
20. QDM3525

This professional-grade stencil is an essential tool for technicians specializing in mobile phone repairs, offering reliability and precision in one package.

Package Content*

1 x Stencil.