Amaoe IP 6/6 Plus Stencil for iPhone 6, iPhone 6 Plus

AMAOE IP 6/6PLUS BGA IC REWORK REBALLING STENCIL

The AMAOE OP-1 IC Reballing Stencil provide the accuracy and reliability necessary for precise chip rework, making complex repairs more manageable. A high-quality BGA reballing stencil is fundamental for this intricate process. 

Purpose: 

• Specific Compatibility: Designed precisely for iPhone 6 and 6 Plus main ICs
• Included Reballing Plate: Comes with a dedicated reballing platform/jig for stable, secure chip placement during the reballing process. 
• High-Precision Laser-Cut Stencil: Ensures exact solder ball patterns, reducing solder overflow and improving ball placement for stable connections.

Feature:

• Compatibility: Specifically for iPhone 6, iPhone 6 Plus (and their main ICs) 
• Material: High-quality Stainless Steel (for stencil), Durable Metal/Aluminum (for plate) 
• Stencil Thickness: 0.12mm 
• Plate Features: Secure magnetic hold/precision grooves for ICs

Package includes:

• 1 x AMAOE IP 6/6PLUS BGA IC Reballing Stencil