AMAOE IP 6G/6P-A8 BGA IC REWORK REBALLING STENCILS 0.12MM

AMAOE IP 6G/6P-A8 BGA Rework Reballing Stencil – Precision Tool

The AMAOE IP 6G/6P-A8 BGA IC Rework Reballing Stencil is designed specifically for the iPhone 6G and 6P A8 chip reballing tasks. Crafted from high-quality stainless steel, this stencil offers precise solder ball placement, ensuring reliable and efficient CPU repairs. Its reusable design makes it a cost-effective solution for technicians, enhancing accuracy and reducing repair time. Compatible with BGA rework stations, the stencil supports flawless chip alignment for best results.

• Precision-cut stainless steel for durability and accuracy
• Compatible with iPhone 6G/6P A8 chips
• Easy to use with precise ball alignment
• Enhances repair quality and reduces rework time

MODEL NUMBERS SUPPORTED:

• IP 6G
• IP PLUS
• A8 CPU

PACKAGE CONTENT

1X AMAOE IP 6G/6P-A8 BGA IC REWORK REBALLING STENCILS 0.12MM