AMAOE LPDDR-1 BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 0.15MM

Amaoe LPDDR-1 Emmc Emcp Bga Reballing Stencil For Ufs Font BGA Reballing Stencil 0.15MM.

Features :
1. Brand New.
2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh

Advantage:
1. Deformation Resistant Material
2. Precise Pins Location
3. Square Round Hole
4. Good Material

Model Numbers Supported ;

BGA134

BGA200

BGA60

BGA168

BGA178

BGA136

Package Content*

1 X Amaoe LPDDR-1 BGA Reballing Stencil For Emmc/Emcp/Ufs Ic Chip 0.15MM