![AMAOE MI-19 CPU BGA REBALLING STENCIL FOR REDMI 13/13 PRO/13 ULTRA - 0.12MM AMAOE MI-19 CPU BGA REBALLING STENCIL FOR REDMI 13/13 PRO/13 ULTRA - 0.12MM](https://abest.b-cdn.net/image/cache/catalog/MI%2019%20-550x550.jpg)
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AMAOE MI-19 CPU BGA REBALLING STENCIL FOR REDMI 13/13 PRO/13 ULTRA - 0.12MM
Product Id: 3580
- Item Code/Product Code: MI-19
- Weight: 0.01kg
₹165.00
₹180.00
Ex Tax: ₹165.00
AMAOE MI-19 CPU BGA REBALLING STENCIL FOR REDMI 13/13 PRO/13 ULTRA - 0.12MM
Features :
1. Brand New.
2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh
Advantage:
1. Deformation Resistant Material
2. Precise Pins Location
3. Square Round Hole
4. Good Material
Model Numbers Supported ;
- 58080
- 77048E
- PM8550VE
- WCN7851
- PM8550BH
- SDR735
- VC7643
- SM8550
- BGA153
- RAM496
- 27999
- 8550VS
- QDM4303
- P1
- JE218
- QET7100
Package Content*
1 X Amaoe MI-19 Stencil.
Tags:
AMAOE
, BALL PLATE
, STENCILS
, REBALLING STENCILS
, BGA STENCILS
, MOBILE IC
, REDMI
, MI STENCILS
,