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AMAOE MI-2 BGA Reballing Stencil for Xiaomi Devices For MSM8974 / 8274 / 8674 CPU

AMAOE MI-2 BGA Reballing Stencil for Xiaomi Devices For MSM8974 / 8274 / 8674 CPU
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AMAOE MI-2 BGA Reballing Stencil for Xiaomi Devices For MSM8974 / 8274 / 8674 CPU

  • Id: 4045

  • Item Code/Product Code: MI 2
  • Weight: 0.05kg
AMAOE AMAOE
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₹145.00
Ex Tax: ₹145.00
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The AMAOE MI-2 stencil module offers precise BGA reballing for MSM8974 / 8274 / 8674 CPU modules, ideal for Xiaomi device repair and motherboard soldering
Features:
  1. Made of strong stainless steel
  2. 0.12mm thickness for accuracy
  3. Reusable and durable
  4. Easy to use for mobile repair
  5. Durable, reusable design for professional rework environments
  6. Precision-aligned holes for accurate solder ball placement
Model Numbers Supported:
  1. MSM8974
  2. MSM8274
  3. MSM8674
Package includes:
  • 1 x Stencil

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Tags: AMAOE , M2 , Stencil , BGA Reballing Stencil , Xiaomi CPU Reballing , Reballing Stencil , MI-2 , MI3 , 3S , NOTE , XIAOMI 4 , REDMI

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