AMAOE MI-2 BGA Reballing Stencil for Xiaomi Devices For MSM8974 / 8274 / 8674 CPU
Id: 4045
- Item Code/Product Code: MI 2
- Weight: 0.05kg
- SKU: 18194
₹140.00
Ex Tax: ₹140.00
MI2 BGA Reballing Stencil for Redmi 3/3s/Note | Precision Repair
Every mobile repair technician knows the frustration of inconsistent reballing—misaligned solder balls, weak connections, or repeated do-overs that waste time and money. That's where high-precision BGA stencils come in.
The MI2 BGA Reballing Stencil is engineered specifically for Redmi 3/3s/Note devices, offering unmatched accuracy and durability. For technicians dealing with motherboard-level chip work, this tool is a game-changer.
Features:
- Made of strong stainless steel
- 0.12mm thickness for accuracy
- Reusable and durable
- Easy to use for mobile repair
- Durable, reusable design for professional rework environments
- Precision-aligned holes for accurate solder ball placement
Model Numbers Supported:
- MSM8974
- MSM8274
- MSM8674
Expert Tips for Optimal Use & Maintenance:
Here are some best practices for using your MI2 BGA stencil effectively:
- Align Carefully: Use tweezers and magnification to match chip pads perfectly.
- Clean After Each Use: Use isopropyl alcohol and a lint-free cloth to prevent paste buildup.
- Store Flat & Dry: Avoid bending. Use a protective case to maintain shape.
- Use Consistent Heat: Pair with a quality hot air station for uniform heating during soldering.
- Following these steps can extend your stencil's life and maintain high-quality rework standards.
Why Choose the MI2 BGA Reballing Stencil?
- We understand what matters to mobile repair pros:
- Superior Craftsmanship – Every hole, every cut, optimized for professional use.
- Redmi-Specific Fit – Tailored layout for Redmi 3, 3s, and Note models.
- Trusted by Technicians – Field-tested by repair experts for repeatable precision.
- Time-Saving Design – Faster setup, fewer mistakes, smoother repairs.
Package includes:
- 1 x Stencil
