New
AMAOE MI-3 BGA Reballing Stencil 0.12mm for MSM8916 / 8928 / MT6592 CPU
Id: 4046
- Item Code/Product Code: MI 3
- Weight: 0.05kg
- SKU: 18195
₹140.00
Ex Tax: ₹140.00
The MI3 stencil is designed for MSM8916/8928/MT6592 CPUs found in Xiaomi Redmi Note, Redmi 2/2A devices
The AMAOE MI3 stencil is a special tool for BGA reballing. Technicians use it for advanced repairs on smartphone motherboards, especially for Xiaomi devices. Here's what it's used for:
The MI3 stencil was made for MSM8916, 8928, and MT6592 CPUs. These CPUs are in Xiaomi Redmi Note and Redmi 2/2A devices. Technicians use it to create precise solder ball patterns when replacing or repairing BGA (Ball Grid Array) chips.
Features:
- Made of strong stainless steel
- 0.12mm thickness for accuracy
- Reusable and durable
- Easy to use for mobile repair
- Durable, reusable design for professional rework environments
- Precision-aligned holes for accurate solder ball placement
Model Numbers Supported:
- MSM8916
- MSM8928
- MT6592
Package includes:
- 1 x Stencil
