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AMAOE MI-8 BGA Reballing Stencil Compatible with Xiaomi Mi8, Mi8 SE, Mi Mix 3 – 0.12mm

AMAOE MI-8 BGA Reballing Stencil Compatible with Xiaomi Mi8, Mi8 SE, Mi Mix 3 – 0.12mm
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AMAOE MI-8 BGA Reballing Stencil Compatible with Xiaomi Mi8, Mi8 SE, Mi Mix 3 – 0.12mm
  • Id: 4048

  • Item Code/Product Code: MI 8
  • Weight: 0.05kg
  • SKU: 18200
₹140.00
Ex Tax: ₹140.00
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AMAOE MI-8 BGA Reballing Stencil for Xiaomi Mi 8 Series Repairs

The AMAOE MI-8 stencil module ensures precise BGA reballing for MSM8956 / 8976 / 8998 CPU chips, ideal for Xiaomi Mi8, Mi8 SE, and Mi Mix 3 repairs.

Why Choose the AMAOE MI-8 Stencil
  • Precision Laser-Cut Holes: Each hole is engineered for exact chip patterns. The precise cuts reduce solder overflow and ensure better ball placement. This leads to stable connections and reduces the need for rework.
  • Durable Stainless Steel Build: Crafted from high-grade stainless steel, the stencil resists warping under high heat. It’s reusable, long-lasting, and built to survive the harsh environment of soldering stations.
  • Magnetic and Heat-Resistant Design: Its magnetic surface holds IC chips steady during reballing. The heat-resistant metal supports consistent temperature handling, improving safety and reducing component damage.
  • Broad Compatibility: Specifically designed for Xiaomi Mi8, Mi8 SE, and Mi Mix 3 models. No more wasting time with generic stencils that don’t fit properly.
  • Anti-Slip Surface: The anti-slip design helps technicians keep the stencil in place. This improves workflow speed and minimizes handling errors during soldering.
Features:
  1. Made of strong stainless steel
  2. 0.12mm thickness for accuracy
  3. Reusable and durable
  4. Easy to use for mobile repair
  5. Durable, reusable design for professional rework environments
  6. Precision-aligned holes for accurate solder ball placement
Model Numbers Supported:
  • MSM8956
  • MSM8976
  • MSM8998
Tips for Optimal Use and Maintenance
  • Clean the stencil after each use with isopropyl alcohol and a soft brush.
  • Align the chip carefully before applying solder balls or paste.
  • Store in a dry, flat container to avoid bending or corrosion.
  • Use with a preheater to maintain even temperature distribution.
Package includes:
  • 1 x Stencil

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