AMAOE Middle Layer Stencil for iPhone 15, 15 Plus Reballing

Amaoe iPhone 15, 15 Plus Middle Layer Reballing Stencil

For accurate iPhone 15 and 15 Plus middle layer repairs, a specialized stencil is indispensable. The intricate nature of stacked motherboards demands extreme precision for reballing interconnects. Achieve precise iPhone 15, 15 Plus middle layer BGA reballing with Amaoe's advanced stencil. Ensure stable motherboard repairs & flawless chip placement.

Features:

• Material: Durable Japanese steel
• Thickness: 0.12mm for precision use
• Reusability: Long-lasting, reusable stencil
• Design: Accurate square-hole layout
• Compatibility: Made for iPhone 15, iPhone 15 Plus

Model Numbers Supported

• iPhone 15
• iPhone 15 Plus

Package Includes

• 1 × AMAOE Middle Layer Reballing Stencil (for iPhone 15 / 15 Plus)