AMAOE MU-6 Multi-Module BGA Reballing Stencil
The AMAOE MU-6 stencil is designed for precision reballing of high-performance MediaTek chipsets. Compatible with multiple modules including MT6989W, MT6985W, MT6886V, MT6781V, MT6897Z, and MT6878V, it delivers reliable, accurate results for chip-level repair specialists.
Best Use Case
Perfect for technicians and repair labs handling various MediaTek-powered smartphones. Designed for professionals performing repeated BGA chip-level soldering and rework.
Key Features
- Hole Type: Square precision mesh
- Thickness: 0.12mm for optimal heat conduction
- Reusable: Built for multiple repair cycles
- Compatibility: Ideal for hot air and reflow soldering
- Application: Mobile motherboard and power IC rework
Benefits
- Supports a wide range of MediaTek SoCs
- Durable and heat-resistant material extends lifespan
- Ensures perfect ball placement for minimal rework
- Reduces IC soldering errors during repair
- Great for high-volume mobile repair shops
Supported Modules:
- MT6989W
- MT6985W
- MT6886V
- MT6781V
- MT6897Z
- MT6878V
Package includes:
