Amaoe S928U-012 Middle Layer Bga Reballing Stencil For Samsung S24 Ultra
Middle layer BGA reballing on flagship devices like Samsung S24 Ultra is extremely sensitive, where uneven solder balls or misalignment can cause boot failure, heating issues, or unstable signals. Generic stencils often fail to match the exact pad layout, increasing rework risk. The Amaoe S928U 012 Middle Layer BGA Reballing Stencil is designed specifically to solve this problem with an accurate 0.12mm thickness matched to the S24 Ultra middle layer structure. It ensures consistent solder ball formation and precise alignment. Technicians trust this stencil because it improves reballing accuracy, reduces repeat repairs, and delivers stable professional-level results on high-density BGA layouts.
Key Features
- Dedicated middle layer BGA stencil for Samsung S24 Ultra
- Precise 0.12mm thickness for controlled solder volume
- Accurate pad alignment for stable reballing results
- Designed for high-density BGA IC structures
- Helps prevent solder bridging and cold joints
- Supports clean and repeatable reballing process
- Suitable for professional motherboard repair work
Specification Key
| Parameters | Details |
|---|
| Brand | Amaoe |
| Model | S928U-012 |
| Type | Middle layer BGA reballing stencil |
| Thickness | 0.12mm |
| Compatibility | Samsung Galaxy S24 Ultra |
| Application | Middle layer BGA IC reballing |
Supported IC Model Numbers
- Samsung Galaxy S24 Ultra – S928U
- Samsung Galaxy S24 Ultra – S928W
- Samsung Galaxy S24 Ultra – S9280
- Samsung Galaxy S24 Ultra – S928D
Usage Benefit
- Achieve uniform solder ball height during reballing
- Improve success rate on Samsung S24 Ultra motherboard repair
- Reduce risk of IC misalignment and signal failure
- Save time by avoiding repeated rework cycles
- Suitable for advanced flagship-level repairs
- Enhances long-term stability of repaired boards
Installation Tips
- Clean IC and pad area thoroughly before reballing
- Align stencil accurately with the middle layer pads
- Use appropriate solder paste or solder balls for 0.12mm stencil
- Apply even heat during reflow
- Allow board to cool naturally before removal
Product Package
- 1x Amaoe S928U-012 Stencil
FAQs
- Q1. Why this product is needed for Samsung S24 Ultra repair
- Because the middle layer BGA layout requires precise solder volume and alignment that generic stencils cannot provide.
- Q2. Is this stencil compatible with other Samsung models
- No, it is designed specifically for Samsung S24 Ultra middle layer reballing.
- Q3. What thickness does this stencil use
- It uses a 0.12mm thickness for accurate solder ball formation.
- Q4. Is this suitable for professional technicians
- Yes, it is intended for professional motherboard and IC repair work.
- Q5. Can it help reduce reballing failure
- Yes, accurate alignment and solder volume control improve reballing success rate.
