Amaoe Precision Middle-Layer BGA Stencil for Snapdragon SM7550 (7 Gen 3) Reballing
Reballing modern flagship CPUs like Snapdragon 7Gen3 requires absolute accuracy. Using incorrect stencil thickness or misaligned pad layouts can result in cold joints, uneven balls, or CPU failure after reinstallation. The Amaoe SM7550 BGA Stencil (0.12MM) is engineered specifically for Snapdragon SM7550 (7 Gen 3) CPUs. It provides precise pad alignment and uniform solder ball formation, ensuring reliable CPU reballing results during advanced motherboard repair. Manufactured with high-precision laser cutting and hardened steel material, this stencil maintains shape stability even under repeated high-temperature use. Professional technicians rely on Amaoe stencils because they reduce rework time, improve success rates, and deliver consistent, factory-level reballing quality.
Key Features
- Designed specifically for Snapdragon SM7550 (7 Gen 3) CPU
- 0.12MM thickness for accurate solder ball height
- High-precision laser-cut pad alignment
- Strong steel material, resistant to warping
- Clean solder release for uniform ball formation
- Suitable for professional motherboard repair workflows
Specification Key
| Parameter | Details |
|---|
| Brand | Amaoe |
| Model | SM7550 |
| CPU Series | Snapdragon 7Gen3 |
| Stencil Type | BGA Reballing Stencil |
| Layer | CPU / Middle Layer |
| Thickness | 0.12MM |
| Material | Hardened precision steel |
| Application | CPU reballing & motherboard repair |
Supported IC Model Numbers
- SM7550 (Snapdragon 7 Gen 3 CPU)
- PM7550
- PM7550BAH
- WCN6755
- SDR435
- SC8582
- 77058D
- 77052B
- QDM5303
- 2U2
- 220TB0TB
- 8550VS
Usage Benefits
- Accurate CPU reballing with correct solder height
- Reduces risk of short circuits and cold joints
- Improves motherboard repair success rate
- Saves technician time during CPU rework
- Ensures stable long-term CPU performance after repair
Reballing Tips
- Always clean CPU pads before applying solder paste
- Use correct solder ball size compatible with 0.12MM stencil
- Apply even pressure during heating
- Allow stencil to cool before removal
- Clean stencil holes after each use for best results
Product Package
- 1 × Amaoe SM7550 7 Gen 3 Stencil (0.12MM)
FAQs
- Q1. Is this stencil only for SM7550 CPU?
- Yes, it is designed specifically for Snapdragon 7 Gen 3 (SM7550).
- Q2. Why 0.12MM thickness is important?
- It ensures correct solder ball height for stable CPU connection.
- Q3. Can it be reused multiple times?
- Yes, it is made for repeated professional use.
- Q4. Does it support flagship-level repairs?
- Yes, it is suitable for high-end motherboard rework.
- Q5. Is this a middle-layer stencil?
- Yes, it is designed for CPU / middle-layer reballing.
