
New
AMAOE U QSD10 Reballing Stencil for Snapdragon 865
Id: 4055
- Item Code/Product Code: U QSD10
- Weight: 0.05kg
₹145.00
Ex Tax: ₹145.00
The AMAOE U-QSD10 BGA Reballing Stencil is specially designed for Qualcomm Snapdragon 8 Gen 2 (SM8550) processors/SoCs.
Features:
- Made of strong stainless steel
- 0.12mm thickness for accuracy
- Reusable and durable
- Easy to use for mobile repair
- Durable, reusable design for professional rework environments
- Precision-aligned holes for accurate solder ball placement
Model Numbers Supported:
- Qualcomm Snapdragon 8 Gen 2 (SM8550)
- Compatible with devices using SM8550 processor
Tags:
AMAOE
, U-QSD10
, reballing stencil
, mobile repair
, BGA rework
, Snapdragon 865
, chip repair