AMAOE U QSD10 Reballing Stencil for Snapdragon 865
                    
          
                      Id: 4055
- Item Code/Product Code: U QSD10
 - Weight: 0.05kg
 - SKU: 37864
 
₹140.00
                            Ex Tax: ₹140.00
                          
                        The AMAOE U-QSD10 BGA Reballing Stencil is specially designed for Qualcomm Snapdragon 8 Gen 2 (SM8550) processors/SoCs.
Features:
- Made of strong stainless steel
 - 0.12mm thickness for accuracy
 - Reusable and durable
 - Easy to use for mobile repair
 - Durable, reusable design for professional rework environments
 - Precision-aligned holes for accurate solder ball placement
 
Model Numbers Supported:
- Qualcomm Snapdragon 8 Gen 2 (SM8550)
 - Compatible with devices using SM8550 processor
 
Package includes:
- 1 x Stencil
 

          Tags:
                      AMAOE
            ,                      U-QSD10
            ,                      reballing stencil
            ,                      mobile repair
            ,                      BGA rework
            ,                      Snapdragon 865
            ,                      chip repair