-550x550.jpg "Amaoe U QSU6 Qualcomm CPU BGA Reballing Stencil 0.12MM")
-80x80.jpg "Amaoe U QSU6 Qualcomm CPU BGA Reballing Stencil 0.12MM")
Id: 4547
- Item Code/Product Code: U-QSU6
- Weight: 0.05kg
- SKU: 52808
Amaoe U QSU6 0.12MM Qualcomm CPU integrated BGA stencil for precise reballing
Reballing Qualcomm CPUs requires exact ball alignment and controlled solder volume. Using incorrect thickness or misaligned stencil often causes short circuits, poor bonding, or uneven solder height. The Amaoe U QSU6 0.12MM BGA Stencil is designed for professional Qualcomm CPU reballing work. It supports multiple Snapdragon series processors in one integrated layout, reducing the need for multiple separate stencils. With optimized heat dissipation hole design and anti-deformation structure, this stencil maintains flatness during heating, ensuring consistent solder ball formation. Technicians prefer it for stable positioning, precise alignment, and repeatable reballing accuracy.
Features
- 0.12MM thickness for controlled solder ball height
- Integrated Qualcomm CPU multi-model layout
- Anti-warp design for stable heating
- High precision laser-cut openings
- Strong flatness for accurate ball placement
- Designed for professional BGA rework use
Specification Key
| Parameters | Details |
|---|---|
| Brand | Amaoe |
| Model | U QSU6 |
| Thickness | 0.12MM |
| Type | Qualcomm CPU BGA Reballing Stencil |
| Material | High precision stainless steel |
| Application | Snapdragon CPU reballing |
Model Numbers Supported
- Snapdragon 8 Gen 3 SM8750
- Snapdragon 8s Gen 3 SM8635
- Snapdragon 7s Gen 3 SM7635
- Snapdragon 6 Gen 1 SM6450
- Snapdragon 8 Gen 3 SM8650
- BGA496 layout
- Snapdragon 4 Gen 2 SM4450
- Snapdragon 7 Gen 3 SM7550
Benefits
- Ensures uniform solder balls on dense BGA ICs
- Reduces solder bridging and cold joints
- Saves time by supporting multiple ICs in one stencil
- Improves chip alignment during hot air reflow
- Ideal for advanced processor and baseband repairs
- Clean CPU pad surface before placing stencil
- Use proper 0.12MM compatible solder balls
- Apply even solder paste if required
- Maintain stable hot air temperature
- Avoid excessive pressure during heating
Package Content
- 1x Amaoe U QSU6 0.12MM BGA Stencil
FAQs
- Q1. Why this product is needed?
- Qualcomm CPUs require precise reballing alignment. This stencil ensures accurate solder ball placement and consistent height control.
- Q2. What thickness is this stencil?
- It is 0.12MM thickness as marked on the stencil.
- Q3. Does it support multiple Snapdragon CPUs?
- Yes, it supports several Snapdragon models printed directly on the stencil.
- Q4. Is it suitable for beginners?
- Recommended for trained technicians with BGA rework experience.
- Q5. Can it prevent CPU warping during heating?
- The anti-deformation design helps maintain flatness during heating.
