MaAnt C1 Magnetic CPU Reballing Platform 73 in 1 Universal Planting Set for BGA Repair

MaAnt C1 Magnetic Planting Platform for Accurate CPU Reballing and IC Alignment

CPU reballing and IC repair require extreme precision, and even a slight misalignment can lead to failed repairs or repeated work. Traditional methods often lack stability, making it difficult to hold chips and stencils in place during soldering. The MaAnt C1 Magnetic CPU Reballing Platform (73 in 1 Set) is engineered to provide automatic precise positioning with strong magnetic adsorption, ensuring stable alignment during reballing. Its high-temperature resistant synthetic base and magnetic clamping system allow technicians to work efficiently across multiple CPU types. Designed for professional chip-level repair, it supports a wide range of processors and storage ICs, making it a complete solution for advanced motherboard repair tasks. As shown in the product visuals, the platform uses magnetic positioning and firm clamping for one-step maintenance, ensuring accuracy and consistency during every operation.

Features

• 73 in 1 complete reballing stencil platform set
• Strong magnetic adsorption for firm IC positioning
• Automatic precise alignment system
• High temperature resistant synthetic stone base
• Supports multiple CPU and eMMC formats
• Easy one-step clamping and operation
• Durable design for professional use

Specification

Support Modules (CPU & IC Compatibility)

For iPhone CPU (A-Series)

• A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18 Pro, A19 Pro

For Hisilicon CPU (Huawei Series)

• Hisilicon 960, 970, 980, 990
• Hisilicon 710, 810, 820/985
• Kirin 9000, 9000S, 9020

For Qualcomm CPU (Snapdragon Series)

• Snapdragon 845, 855
• Snapdragon 750G, 765G, 778G
• Snapdragon 865 / 870 (Big & Small)
• Snapdragon 888 / 888 Plus
• Snapdragon 8 Gen 1, 8+ SM8475
• Snapdragon 8 Gen 2 SM8550, Gen 3

For MediaTek MTK CPU

• MTK 720, 800, 810, 900
• MTK 1000, 1100/1200
• MTK 8100, 9000, 9200, 9300

For Samsung CPU (Exynos Series)

• Exynos 8895, 980
• Exynos 9820, 990
• Exynos 1080, 2100, 2200

For eMMC / RAM BGA Formats

• BGA221, BGA162, BGA134
• BGA178 (Small), BGA153
• BGA254 (Small), BGA169, BGA86
• Hisilicon / Qualcomm RAM Support

Benefits or Usage

• Ensures precise IC alignment during reballing
• Reduces failure rate in CPU repair
• Saves time with magnetic positioning system
• Supports wide range of processors and chips
• Ideal for professional technicians and labs

Installation Tips

• Select correct stencil for CPU type
• Clean IC and platform before use
• Align chip carefully using magnetic guide
• Apply uniform heat during reballing
• Avoid overheating sensitive components

Package

• 1 × MaAnt C1 Magnetic Platform
• 73 × CPU / eMMC Reballing Stencils

FAQs

• Q1. What is MaAnt C1 used for?
• It is used for CPU reballing and IC repair with precise alignment and magnetic positioning.
• Q2. How many stencils are included?
• It includes a 73 in 1 stencil set covering multiple CPU types.
• Q3. Does it support different chip brands?
• Yes, it supports Apple, Qualcomm, Hisilicon, MediaTek, Samsung, and eMMC formats.
• Q4. What is the advantage of magnetic platform?
• It ensures stable positioning and reduces misalignment during reballing.
• Q5. Is it suitable for beginners?
• It is recommended for technicians with basic chip-level repair knowledge.