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MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML

MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
-20 %
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
MECHANIC ISM5 183℃ LIQUID SOLDER PASTE ‏FOR PHONE JUMPER WIRE - 3ML
  • Id: 2177

  • Item Code/Product Code: ISM5
  • Weight: 0.05kg
  • SKU: 15433
₹199.00
₹250.00
Ex Tax: ₹199.00
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MECHANIC iSm5 Special Solder Paste for Phone Jumper Wire – High-Precision Soldering Solution

The Mechanic ISM5 Fly Line Special Solder Paste 3ML is engineered for ultra-precise jump wire and fly line repair work commonly used in motherboard-level mobile repairing. Its optimized melting point of 220 to 230 degree Celsius ensures fast, clean soldering without spattering or residue formation. Designed for professional repair engineers, this high-activity paste provides strong solder flow, controlled bonding strength, and stable conductivity, allowing technicians to achieve clean and durable micro-joints even on the smallest pads and PCB tracks. Whether you're fixing broken lines, attaching micro jump wires, or performing delicate trace repairs, the Mechanic ISM5 paste delivers reliable performance, smooth consistency, and perfect application control. Ideal for advanced mobile, laptop, and chip-level service centers.

Features 

  • High-activity solder paste for jump wire and fly line repair
  • Melting temperature between 220 to 230 degree Celsius
  • Smooth, stable flow for ultra-thin micro soldering
  • Designed for mobile motherboard and IC repair specialists
  • Provides strong bonding with excellent conductivity
  • Works well for trace correction and broken pad rework
  • Comes with precision applicator tips for easy control
  • Consistent performance with minimal residue

Specifications Key

ParameterDetails
BrandMechanic
ModelISM5
TypeFly Line Special Solder Paste
Capacity3ML
Melting Temperature                                                         220 to 230 °C
ApplicationJump Wire Repair, Fly Line, PCB Micro Soldering
ConsistencyHigh Activity Smooth Paste
Flux TypeMicro Solder Adhesive Paste
UsageMobile Motherboard Level Repair
Included Accessories2 Precision Needle Tips
ConditionNew Professional Grade

Benefits 

  • Perfect for attaching micro jump wires on dense PCB areas
  • Ensures strong, stable, and conductive solder joints
  • Ideal for repairing broken tracks and pads
  • No splash or over-spreading during heating
  • Safe for high-precision chip-level work
  • Provides fast melting and reliable bonding strength

Installation Tips

  • Clean PCB surface before applying paste
  • Use a fine tip syringe for controlled application
  • Heat with hot air around 220 to 230 degree Celsius
  • Avoid excess heat to protect nearby components
  • Keep needle tip clean for smooth output

Package Content

  • 1 × Mechanic ISM5 Solder Paste 3ML

Why Choose MECHANIC iSm5?

  • Precise Soldering: Specially designed for phone jumper wire applications, allowing precise soldering with minimal effort.
  • High Activity: Ensures a fast, efficient tinning process, reducing time and effort during repairs.
  • Moderate Viscosity: Offers the perfect balance for smooth, easy application, even in small areas.
  • Reliable Performance: Delivers consistently strong bonds, making it ideal for mobile phone repairs, especially when working with delicate jumper wires.

The MECHANIC iSm5 Solder Paste is the perfect tool for technicians and DIY enthusiasts looking for a reliable, high-performance solution for mobile phone jumper wire repairs. With its advanced formulation and ease of use, it ensures professional results every time.

FAQs

  • Q1: What is Mechanic ISM5 used for?
  • It is used for fly line, jump wire, and micro soldering repair on mobile PCBs.
  • Q2: What is the melting temperature?
  • It melts between 220 to 230 degree Celsius.
  • Q3: Can beginners use this paste?
  • Yes, but it is designed mainly for professional technicians.
  • Q4: Does it work for repairing broken pads?
  • Yes, it is ideal for pad repair and micro trace correction.
  • Q5: Does it come with needles?
  • Yes, it includes two precision applicator needle tips.




Features

Special for jump wire repair


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