New
Mijing 3D A9 BGA Reballing Stencil for Apple iPhone 6S / 6S Plus Series
Id: 4037
- Item Code/Product Code: A9
- Weight: 0.05kg
₹450.00
Ex Tax: ₹450.00
Mijing 3D A9 BGA Reballing Stencil Plant Tin Steel Net for iPhone 6S / 6S Plus Series IC Repair tool
Features:
- High-temperature resistance can be used 100000 times
- 3D groove design enables stencil to align with the tinning position of IC rapidly.
- The square holes design makes it easier to take out the formed solder balls.
- This 3D stencil is easy to use no matter you are a new or an expert.
- With the high success rate of planting tin, the solder balls can be formed once after you are proficient.
- Square rounded hole design
- High-temperature resistance up to 700°C
Package includes:
- 1 x 3D Stencil
