Mijing Z20 Pro Middle Layer Motherboard Stencil Platform Set For iPhone X To 16 Pro Max
                    
          
                      Id: 4036
- Item Code/Product Code: Z20 Pro
 - Weight: 0.25kg
 - SKU: 34725
 
₹3,650.00
                            Ex Tax: ₹3,650.00
                          
                        MiJing Z20 Pro Motherboard Middle Layer Planting Tin Platform for iPhone X to 16 Pro Max
The Mijing Z20 Pro is a professional-grade BGA reballing stencil platform designed for iPhone models from X to 16 Pro Max. It facilitates accurate and efficient reballing of middle-layer PCBs, ensuring damage-free soldering. The fixture securely holds the motherboard, allowing for precise alignment and tin application.
Key Features of the Mijing Z20 Pro: A Deep Dive
1. Precision Laser-Cut Holes
- A CNC laser cuts each opening for accuracy. This ensures that solder balls fit perfectly. This is important for high-density ICs and BGA chips on iPhones.
 - Why it matters: Reduces solder overflow and guarantees clean joints—no rework required.
 
2. High-Grade Stainless Steel Body
- Made with durable, heat-resistant stainless steel, the Z20 Pro withstands repeated heat cycles without warping.
 - Why it matters: Ensures consistent reballing across sessions, even under intense hot air exposure.
 
3. Broad iPhone Compatibility
- It covers all models from iPhone X to 16 Pro Max. This makes it a useful tool for technicians working on both old and new phones.
 - Why it matters: No need to switch stencils across different jobs—one tool fits all mid-layer tasks.
 
4. Magnetic Anti-Slip Base
- The platform has a magnetic grip and anti-slip surface to hold logic boards steady during rework.
 - Why it matters: Prevents movement, ensures alignment, and reduces chances of solder mistakes.
 
5. Easy to Clean and Maintain
- Non-stick coating and simple geometry make cleaning fast with isopropyl alcohol or ultrasonic cleaners.
 - Why it matters: Saves technicians time and maintains stencil accuracy longer.
 
Tips for Optimal Use and Maintenance:
- Install the main
board on the platform
 - Cover the BGA
reballing stencil on the mainboard
 - Evenly spread tin on
the cover of the reballing stencil
 - Remove the reballing stencil cover
 - Take out the motherboard and cooperate with the hot air gun to solidify the tin point
 
Package includes:
1 x Z20 Pro Set With Base & Stencils (for Iphone X to 16 pro max)








          Tags:
                      Mijing
            ,                      Z20 Pro
            ,                      Stencils
            ,                      Reballing Stencils
            ,                      Stencils
            ,                      Ball Plate
            ,                      Iphone Stencils
            ,                      Middle Layer Stencils
            ,                      Iphone 16
            ,                      Amaoe
            ,                      Solder Paste
            ,