Id: 4508
- Item Code/Product Code: OS G1
- Weight: 0.00kg
- SKU: 52121
One Stop OS G1 Ultra White Explosion Glass For Tin Ball Protection
The One Stop OS-G1 Explosion Proof Tin Glass is a precision ultra-white glass sheet designed to protect solder balls during BGA reballing operations. Placed over the stencil during tin application, it prevents mesh bulging and sudden solder ball bursting caused by uneven heat or pressure. This glass is widely used by chip-level technicians to improve reballing safety, stability, and consistency in professional motherboard repair environments. During BGA reballing, technicians often face solder ball splatter or mesh deformation due to heat expansion. The OS-G1 explosion-proof glass acts as a stabilizing layer, distributing pressure evenly and reducing sudden tin movement. This simple addition significantly lowers rework risk and protects both the stencil and IC surface.
Features
- Explosion-proof ultra-white glass construction
- Prevents solder ball bursting during heating
- Reduces stencil mesh bulging
- Smooth flat surface for even pressure distribution
- Reusable with proper cleaning
- Compact size suitable for BGA reballing workstations
Specification Key
| Parameter | Details |
|---|---|
| Brand | One Stop |
| Model | OS-G1 |
| Product type | Explosion-proof tin glass |
| Material | Ultra-white glass |
| Size | 20 x 20 x 1 mm |
| Weight | Approx. 9 g |
| Packaging size | 36 x 16 x 95 mm |
| Function | Stabilizes tin and prevents solder ball burst |
Benefits
- Improves safety during BGA tin placement
- Enhances solder ball consistency
- Protects steel mesh stencils from deformation
- Reduces accidental tin splatter
- Ideal for PM IC and CPU reballing tasks
Installation Tips
- Place the glass directly over the stencil after solder ball placement
- Ensure the glass surface is clean and flat
- Apply uniform heat during reflow
- Allow cooling before removing the glass
- Clean after use to maintain clarity and effectiveness
Package Content
- 1 x One Stop OS-G1
Faqs
- Q1. What is the purpose of explosion-proof tin glass?
- It prevents solder balls from bursting and reduces stencil bulging during heating.
- Q2. Can this be reused?
- Yes, it can be reused if cleaned properly after each operation.
- Q3. Is this glass specific to any IC model?
- No, it is universal and can be used with multiple BGA stencil types.
- Q4. Does it replace the stencil?
- No, it is used along with the stencil as a protective layer.
- Q5. Is this suitable for professional repair labs?
- Yes, it is designed for chip-level and motherboard repair environments.
