Id: 4510
- Item Code/Product Code: U-QSU5
- Weight: 0.05kg
- SKU: 52049
AMAOE U QSU5 0.12mm Precision Stencil For Snapdragon Gen Series CPUs
The AMAOE U-QSU5 Universal BGA Reballing Stencil is engineered for high-density Qualcomm Snapdragon CPU reballing, especially for newer Gen-series processors. Manufactured with 0.12mm laser-cut stainless steel, it delivers accurate solder ball alignment, consistent height control, and reduced thermal deformation. This stencil is ideal for advanced motherboard repairs involving flagship Snapdragon chipsets. Snapdragon Gen CPUs feature dense BGA layouts where uneven solder volume can cause boot loops, overheating, or dead CPU faults. The U-QSU5 stencil solves this by offering precisely matched CPU pad layouts, reducing rework risk and ensuring stable reflow during high-temperature operations.
Features
- 0.12mm optimized thickness for CPU-grade solder control
- Dedicated Qualcomm Snapdragon CPU layouts
- High-precision laser cutting for clean ball formation
- Anti-bulge heat dissipation hole design
- Supports multiple flagship CPUs on one stencil
- Durable stainless steel construction
- Reusable with proper maintenance
Specification Key
| Parameter | Details |
|---|---|
| Brand | AMAOE |
| Model | U-QSU5 |
| Stencil type | Universal BGA reballing stencil |
| Thickness | 0.12mm |
| Material | Stainless steel |
| IC platform | HiSilicon |
| Cutting process | Laser precision |
| Application | Chip-level motherboard repair |
Model Numbers Supported
- Snapdragon 888 – SM8350
- Snapdragon 865 and 870 – SM8250-002 (Large)
- Snapdragon 865 – SM8250-102 (Small)
- Snapdragon 7 Gen 2 – SM7475
- Snapdragon 8 Gen 1 – SM8450
- Snapdragon 8 Plus Gen 1 – SM8475
- Snapdragon 8 Gen 2 – SM8550
- Snapdragon 8 Gen 1 – SM8450
- RAM 496
- RAM 556
- Snapdragon 8 Gen 2 – SM8550
Benefits
- Ensures uniform solder balls on dense BGA ICs
- Reduces solder bridging and cold joints
- Saves time by supporting multiple ICs in one stencil
- Improves chip alignment during hot air reflow
- Ideal for advanced processor and baseband repairs
Package Content
- 1 x AMAOE U-HIS4 BGA Reballing Stencil
FAQs
- Q1. Which IC category is this stencil designed for?
- It is designed specifically for Qualcomm Snapdragon CPU reballing.
- Q2. Does this support Gen-series Snapdragon CPUs?
- Yes, it supports Snapdragon 7 Gen 2, 8 Gen 1, 8 Plus Gen 1, and 8 Gen 2 CPUs.
- Q3. What thickness does this stencil use?
- The stencil uses a 0.12mm thickness for precise solder control.
- Q4. Is this suitable for beginners?
- It is recommended for experienced technicians due to dense CPU BGA layouts.
- Q5. Can it be reused?
- Yes, with proper cleaning and careful handling.
