MAANT SL-1 GLUE MELTING BY MAGIC FURNACE FOR EMMC/CPU IC CHIP HEATING DE-GUMMING AND DE-TINNING

MaAnt SL-1 Deicing by Magic Furnace for IC Chip Heating De-gumming and De-tinning

Features:

• One-button heating, rapid heating, the temperature can be adjusted 160-250C, support multi-generation Apple, Huawei chip glue removal, tin removal work
• This applies to 99%of the chips on the market, 20mm x 18.5mm working area, supports multiple generations Apple mobile phone chip, Huawei mobile phone chip universal hard disk, and CPU Glue detinning
• When heating, the temperature can be adjusted between 160℃ and 250℃, effectively avoid due to high temperatures or improper training Burn-out chip
• After opening the glue removal table and heating it to the set temperature, you can use the brush or cotton ball and a cotton swab to remove the residual tin
• No tin line, a wipe can easily remove tin and glue, and easy and quick tin planting
• Air gun heating is safer than 100 degrees lower than air gun temperature scraping
• No soldering iron heating without repeated scraping of a soldering iron, no damage to the pad
• After heating to a set temperature, use a cotton swab, which can handle clean residual tin without damage to the pad paint Non-absorbent tin brings back the wipe that wears the chip for a long time
• Fast heating, no leakage, no static electricity, safer curve heating, built-in professional adjustment curve, no need to worry, about chip damage caused by thermal stress
• According to the needs of the job, set the temperature adjustment to you, the required temperature, one-click Heat up quickly, no need to worry about temperature over the damaged chip
• Hidden screw, flexible and light, flexible telescopic clamping at the same time, the hidden screw prevents the residue from falling into the screw and is more, durable and useful
• Fast charger support heating work, work want do it right where you are, anytime, anywhere professional

Package includes:

• 1 x Heating Platform