Amaoe 0.08MM Middle Layer BGA Reballing Stencil iPhone 12 Pro Max

Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max

The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a high-precision, laser-cut stainless steel stencil designed specifically for iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an ultra-thin 0.08mm thickness, this stencil ensures perfect solder ball alignment, making it an essential tool for professional microsoldering technicians, phone repair shops, and electronics engineers.

Features:

• Material: High-Quality Stainless Steel
• Thickness: 0.08mm (Ultra-Thin for Precision)
• Compatibility: iPhone 12 Pro Max BGA Chips (CPU, NAND, Baseband, etc.)
• Finish: Smooth Laser-Cut Edges (No Burrs)
• Usage: Reballing, Reflow, Solder Ball Replacement

Package Included:

• 1 × Amaoe 0.08MM BGA Reballing Stencil for iPhone 12 Pro Max