New
Amaoe QU-9 Stencil for SM8750/SM8650/SM8550/SM8450/SM7550
Id: 4072
- Item Code/Product Code: QU-9
- Weight: 0.05kg
- SKU: 38285
₹140.00
Ex Tax: ₹140.00
Amaoe QU-9 BGA Reballing Stencil for Qualcomm Modules
The AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, clean ball placement and consistent results.
Feature:
- Supported Modules: SM8750, SM8635, SM8650, SM8550, SM8450, SM7550
- Material: High-grade Japanese steel
- Stencil Type: Precision-cut BGA mesh
- Thickness: 0.12mm for optimal heat transfer
- Reusable: Yes, multiple uses with no deformation
- Hole Type: Square layout for accurate ball seating
- Use Case: Designed for chip-level reballing and IC repairs
Best
Use Case
Perfect
for mobile phone repair engineers and technicians who work on Qualcomm chipset
reballing and motherboard-level IC repairs.
Benefits
- Supports a wide range of modern Qualcomm chipsets
- Ensures tight alignment for professional-grade repairs
- Reduces solder waste and improves paste control
- Clean laser-cut holes for consistent solder ball accuracy
- Durable and heat-resistant for long-term use
Package
includes:
· 1 x Amaoe QU-9 BGA Stencil
