Amaoe U-Tensor Stencil for Google Phone Tensor CPU 0.12MM

Amaoe U-Tensor BGA Stencil for Google Phone Tensor CPU

The Amaoe U-Tensor 0.12mm Lower Layer BGA Reballing Stencil is engineered for precise soldering of Google's Tensor CPU chips. Its fine design, durable construction, and high reusability make it essential for professional chip-level repair technicians.

Key Features:

• Model: Amaoe U-Tensor
• Stencil Thickness: 0.12mm
• Hole Type: Square for accurate solder ball placement
• Reusable: Yes – multiple cycles of rework
• Finish: Smooth and clean for flux control
• Compatibility: Precisely designed for Google Tensor CPU
• Usage: CPU reballing, IC BGA repair, lab-grade micro soldering

Benefits:

• Highly Precise Hole Design for consistent solder ball placement
• Reusable Metal Build saves costs over repeated jobs
• Perfect Fit for Tensor Chips – eliminates guesswork
• Ideal for Advanced Technicians doing logic board repairs
• Supports high-yield BGA Rework without stencil warping

Packing Details:

• 1 × Amaoe U-Tensor BGA Reballing Stencil

Supported Modules:

• Google Tensor SoC
• Tensor G1 / G2