Id: 4509
- Item Code/Product Code: U HIS4
- Weight: 0.05kg
- SKU: 52050
AMAOE U HIS4 0.12mm Precision Stencil For HiSilicon Baseband And Processor ICs
The AMAOE U-HIS4 Universal BGA Reballing Stencil is designed for accurate and stable reballing of HiSilicon chipset ICs used in advanced smartphone motherboards. Manufactured with 0.12mm laser-cut stainless steel, this stencil ensures uniform solder ball formation, precise pad alignment, and reduced rework risk during high-density BGA operations. It is an essential tool for technicians handling HiSilicon 990 series and Hi3690 platform repairs. HiSilicon processors and baseband ICs feature dense ball layouts where uneven solder height or misalignment can cause boot failure or no-network issues. The U-HIS4 stencil solves this by providing exact pad mapping for multiple HiSilicon ICs on one plate, improving reball success rate and reducing repeat heating damage.
Features
- 0.12mm thickness for controlled solder volume
- Dedicated HiSilicon IC layouts
- High-precision laser cutting for clean ball formation
- Universal multi-IC coverage on one stencil
- Durable stainless steel material
- Clear IC labeling for fast identification
- Reusable with proper cleaning
Specification Key
| Parameter | Details |
|---|---|
| Brand | AMAOE |
| Model | U-HIS4 |
| Stencil type | Universal BGA reballing stencil |
| Thickness | 0.12mm |
| Material | Stainless steel |
| IC platform | HiSilicon |
| Cutting process | Laser precision |
| Application | Chip-level motherboard repair |
Model Numbers Supported
HiSilicon And Related IC Layouts:
- Hi6363
- Hi6526
- Hi6405
- Hi6422
- Hi6421-V8
- Hi6365
- Hi1105
- Hi1103-V1
- Hi6D05
- Hi3690 5G
- Hi3690 4G
- Hi9500-V100
- RAM 376
- BGA200 layouts
- 6H02T
- 6H11
- 6H12
- 540
- 429
- 77038
- 78191-11
Benefits
- Ensures uniform solder balls on dense BGA ICs
- Reduces solder bridging and cold joints
- Saves time by supporting multiple ICs in one stencil
- Improves chip alignment during hot air reflow
- Ideal for advanced processor and baseband repairs
Package Content
- 1 x AMAOE U-HIS4 BGA Reballing Stencil
FAQs
- Q1. What IC platforms is this stencil designed for?
- It is designed specifically for HiSilicon processors and baseband ICs.
- Q2. Is this a universal stencil?
- Yes, it covers multiple HiSilicon IC models on one plate.
- Q3. What thickness does this stencil use?
- It uses a 0.12mm thickness for precise solder control.
- Q4. Can this be reused?
- Yes, with proper cleaning after each use.
- Q5. Is this suitable for professional repair labs?
- Yes, it is intended for chip-level and advanced motherboard repair.
