-550x550.jpg "AMAOE U MTK9 0.12mm Precision Stencil For MediaTek Dimensity Processors")
-80x80.jpg "AMAOE U MTK9 0.12mm Precision Stencil For MediaTek Dimensity Processors")
Id: 4511
- Item Code/Product Code: U MTK 9
- Weight: 0.01kg
- SKU: 52048
Amaoe U MTK9 Universal BGA Reballing Stencil 0.12mm For MediaTek CPU
The AMAOE U-MTK9 Universal BGA Reballing Stencil is engineered for professional reballing of MediaTek Dimensity and MT series CPUs. Designed with 0.12mm laser-cut stainless steel, it ensures accurate solder ball alignment, uniform height control, and stable thermal behavior during high-temperature reflow. This stencil is ideal for technicians handling flagship MediaTek chipset repairs where precision and repeatability are critical. MediaTek CPUs feature dense BGA layouts that are sensitive to uneven solder volume and heat distortion. The U-MTK9 stencil addresses common issues such as ball collapse, bridging, and CPU instability by offering chipset-matched layouts with consistent spacing. This improves success rates and reduces costly rework on high-end MediaTek boards.
Features
- 0.12mm optimized thickness for MediaTek CPU reballing
- Dedicated MediaTek Dimensity layouts on one stencil
- High-precision laser cutting for clean solder ball formation
- Anti-bulge heat distribution hole design
- Supports multiple MTK CPUs in a single plate
- Durable stainless steel construction
- Reusable with proper cleaning
Specification Key
| Parameter | Details |
|---|---|
| Brand | AMAOE |
| Model | U-MTK9 |
| Stencil type | Universal BGA reballing stencil |
| Thickness | 0.12mm |
| Material | Stainless steel |
| IC platform | MediaTek CPU |
| Cutting process | Laser precision |
| Application | CPU-level motherboard repair |
Model Numbers Supported
- MT6991Z
- MT6989W
- MT6985W
- MT6983AEZ
- MT6853AEZ
- MT6797P
- MT6365
- MT6375P
- MT6316
- MT6315
- MT6199W
- MT6195W
- MT6375AEW
- MT6363
- PMIC 9415
- RAM 496
- BGA153 layouts
- SC8571
- VC7643
- 78212 8258
Benefits
- Ensures uniform solder balls on MediaTek CPUs
- Reduces boot failure and overheating risks
- Minimizes solder bridging and pad misalignment
- Saves time by supporting multiple MTK models
- Ideal for advanced smartphone motherboard repair
Installation Tips
- Clean CPU pads thoroughly before reballing
- Use compatible solder ball size for 0.12mm thickness
- Fix stencil securely to avoid movement
- Apply even heat across the CPU surface
- Allow complete cooling before stencil removal
Package Content
- 1 x AMAOE U-MTK9 Stencil
FAQs
- Q1. Is MTK 9 and U-MTK9 the same product?
- Yes. U-MTK9 is the official AMAOE model name for MTK 9 series stencils.
- Q2. Which chipset family does this support?
- It supports MediaTek Dimensity and high-end MT series CPUs.
- Q3. What thickness does this stencil use?
- It uses a 0.12mm thickness for precise solder control.
- Q4. Is this suitable for beginners?
- Recommended for experienced technicians due to dense CPU layouts.
- Q5. Can it be reused?
- Yes, with proper cleaning and careful handling.
